Acknowledgments


Please sign in to view the rest of this entry.

Acknowledgments
AcknowledgmentsThis book could not have been written without the editorial and organiza tional, contributions of Erik Secula. His help is immensely appreciated. I also wish to acknowledge The Semiconductor Electronics Division management’s support and dedication of resources for researching/editing the book.Various sections of the book have benefited by the technical reviews and/or contributing comments of William J. Boettinger, Curt A. Richter, Neil Zimmerman, NIST; Peter Douglas, Custom Chip Connections; Alfaro Callejas, Gaiser Precision Tools; and Robert Chylak, …
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Acknowledgments, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export