Glossary


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Glossary
GlossaryFollowing are definitions of less familiar bonding, metallurgical, and packaging terms and abbreviations. In some cases, terms have been defined in context. If so they will not be redefined here, but referenced to the appropriate chapter. The definitions are not intended to be rigorous, but rather to give an introductory explanation for those who are new to wire bonding. There are several Web glossaries available, and the interested reader can try them for more help (such Web material may change). Autoclave A temperature-humidity stress test used for assessing the reliability of plastic packages. Usually defined as 121°C, 15 PSI, and 100 % RH…
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Glossary, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export