Wire Bonding Process Modeling and Simulation


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Wire Bonding Process Modeling and Simulation
10307001010608Wire Bonding Process Modeling and SimulationIn this chapter, a transient nonlinear dynamic finite element framework is developed which integrates the wire bonding process and the silicon devices under the bond pad. Two major areas are addressed: one is the impact of assembly first wire bonding process and another one is the impact of device layout below the bond pad. Simulation includes the ultrasonic transient dynamic bonding process and the stress wave transferred to bond pad device and silicon in the first bond. The Pierce strain rate dependent model is…
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Wire Bonding Process Modeling and Simulation, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export