An Overview of the Materials and Material Science of Copper, Low-k Devices That Affect Bonding and Packaging


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An Overview of the Materials and Material Science of Copper, Low-k Devices That Affect Bonding and Packaging
1010608An Overview of the Materials and Material Science of Copper, Low-k Devices That Affect Bonding and Packaging
<emphasis role="bold">Introduction</emphasis> It is absolutely essential for anyone involved in advanced wire bonding to understand the properties of all layers below the bond pad that may affect (or be affected by) the bonding process. This chapter presents an overview for understanding the materials, material science, engineering of copp…
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. An Overview of the Materials and Material Science of Copper, Low-k Devices That Affect Bonding and Packaging, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export