Advanced and Specialized Wire Bonding Technologies


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Advanced and Specialized Wire Bonding Technologies
1010608Advanced and Specialized Wire Bonding Technologies (Including High Yield, Fine Pitch, PCBs, Soft Substrates, Extreme Temperature Wire Bonding and Specialized Looping)
<emphasis role="bold">The Technology and Problems of High Yield and Ever-Finer Pitch Wire Bonding, and Specialized Looping</emphasis>
<emphasis role="bold">Introduction to High Yield in Modern Wire Bonding</emphasis>
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Advanced and Specialized Wire Bonding Technologies, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export