Cleaning to Improve Bondability and Reliability


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Cleaning to Improve Bondability and Reliability
1010608Cleaning to Improve Bondability and Reliability
<emphasis role="bold">Introduction</emphasis> Molecular cleaning methods have long been used to remove contaminants during various stages of wafer processing and are absolutely essential for high yield. Wire bonds (as with wafers) cannot be made at a high yield unless the bonding surfaces are also clean. Until about the 1990s, there was little consideration given to a cleaning step specifically designed to improve the yield and reliability of wire bonds. Moder…
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Cleaning to Improve Bondability and Reliability, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export