Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability


Please sign in to view the rest of this entry.

Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability
1010608Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and ReliabilityThis chapter is divided into two independent sections. The first, A (bonding to Au) is updated/shortened from the second edition’s chapter on gold plating. The second section includes information on newer bonding pad plating materials that are mostly nickel-based, which comprise an increasing number of present substrate pads. This change has occurred because the price of Au has reached astronomical heights and other bonding pad materials have b…
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export