Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding


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Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding
1010608Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding
<emphasis role="bold">Gold-Aluminum Intermetallic Compound Formation and Classical Wire-Bond Failures</emphasis>
<emphasis role="bold">Introduction</emphasis> Gold-aluminum intermetallic compound formation and associated Kirkendall voids have resulted in more documented wi…
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export