Introduction to Third Edition


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Introduction to Third Edition
Introduction to Third EditionThe new material in this book was introduced because of new technical areas. (Examples are fine-pitch bonding, Cu wire bonding, as well as different pad metallurgies.) Also, many practical questions have been posed to the author by phone calls, plant visits, e-mails, and during many short courses taught for the University of Arizona, ISHM (IMAPS), SMI, IEEE, and other organizations. Material has been included/updated to answer the most frequently asked of these questions.In 1970, wire bonds caused a large proportion—sometimes as high as one-third of all semiconductor-device field-failures. However, the number of recognized failure …
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Introduction to Third Edition, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export