Wire Bond Testing

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Wire Bond Testing
10106081031600Wire Bond Testing
<emphasis role="bold">Introduction</emphasis> The measurement methods, techniques, and equations used for evaluating wire bonds were developed many years ago and described in earlier editions of this book. Few modern papers present new approaches, except for the testing of fine pitch ball bonds. Therefore, this chapter has been brought up to date, by noting changes required by finer pitch (more fully described in
George Harman: Wire Bonding in Microelectronics, Third Edition. Wire Bond Testing, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export