Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing


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Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing
1010608Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing
<emphasis role="bold">Introduction</emphasis> Various parts of this book use materials science and metallurgical characteristics of bonding wire to explain different bonding phenomena. This chapter includes the stress-strain characteristics, fatigue, wire hardness, and other properties that affect the results of bond tests, bondability, and reliability. This chapter also …
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export