Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism


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Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism
1010608Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism
<emphasis role="bold">Introduction</emphasis> Currently (2008), the interconnections to >90% of integrated circuit (IC) and other semiconductor chips are ultrasonically welded in some manner. The exception being the devices that have solder bumps, or other variations of flip chips (C4), as well as a few thermode-bonded TAB devices (see
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export