The Technical Introduction to the Third Edition


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The Technical Introduction to the Third Edition
1010608The Technical Introduction to the Third EditionCurrently (2008), there are over 8 to 9 billion wires bonded per year on the planet. Most were used in the 160 billion ICs produced, but many more are in interconnect transistors, LEDs, etc. The number of wires (with two bonds on each wire) has increased every year, including recessions to the present, from two or three bonds in 1947 (see Fig. 1-1). The infrastructure is so extensive that no other chip-interconnection method can displace wire bonds in the …
Citation
George Harman: Wire Bonding in Microelectronics, Third Edition. The Technical Introduction to the Third Edition, Chapter (McGraw-Hill Professional, 2010 1997 1989), AccessEngineering Export