INTRODUCTION: "THE PRODUCT COMPLIANCE PUZZLE"


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INTRODUCTION: "THE PRODUCT COMPLIANCE PUZZLE"
INTRODUCTION: "THE PRODUCT COMPLIANCE PUZZLE"Semiconductor equipment design engineers are faced with incredible design challenges to create the next generation process of record (PoR) toolsets for customers. These equipment design challenges are even more complex than you might think. Why? The answer is because semiconductor manufacturing equipment (i.e., for wafer processing) has many different types of hazards with the potential for serious harm to the workers, equipment, and environment. Harm, as defined in this chapter, implies human injury, process equipment damage, facility damage, or environmental impact.The next generation tool designs are harboring even more aggressive hazards due to new reactive c…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. INTRODUCTION: "THE PRODUCT COMPLIANCE PUZZLE", Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export