SUMMARY


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SUMMARY
SUMMARYProcess chamber parts cleaning requirements have changed significantly since they were originally outsourced to specialized third party service providers some 25 years ago. These changes are driven through increasing numbers and combinations of materials and processes that allow improvements in device performance and footprint reduction. Trace metal, ionic, and particulate contamination levels that are near or even beyond current metrology capability are now found to be major impediments to chamber process performance and device yield, "Things that didn't matter before now do." The challenges moving forward include the development of increasingly complex selective stripping technologies, improved handling and packaging solutions, and continued improvements in real-time metrology that can detect even…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. SUMMARY, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export