EQUIPMENT PARTS CLEANING TECHNOLOGY FUNDAMENTALS AND APPLICATIONS


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EQUIPMENT PARTS CLEANING TECHNOLOGY FUNDAMENTALS AND APPLICATIONS
EQUIPMENT PARTS CLEANING TECHNOLOGY FUNDAMENTALS AND APPLICATIONSToday's semiconductor industry is going through a paradigm shift, moving from 2D to 2.5D and 3D structures to meet the demands of Moore's law.2Moore's law mandates that the number of transistors per square inch on integrated circuits have to double approximately every two years since the invention of integrated circuits. Challenges presented by limitations in photolithography have caused the cost of transistors below 28 nm to increase, rather than decrease in order to measure up to Moore's law. Additional pattern and etch steps have been introduced to proces…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. EQUIPMENT PARTS CLEANING TECHNOLOGY FUNDAMENTALS AND APPLICATIONS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export