PAST, CURRENT, AND FUTURE TECHNOLOGIES/APPLICATIONS


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PAST, CURRENT, AND FUTURE TECHNOLOGIES/APPLICATIONS
PAST, CURRENT, AND FUTURE TECHNOLOGIES/APPLICATIONSParts cleaning requirements for sub-20-nm technology nodes have changed drastically. High-volume manufacturing semiconductor industries urge that with the challenges the industry faces from upcoming technologies, "things that didn't matter now do."2 In the past, parts cleaning operations missed the ultraclean revolution as explained in Sec. 44.1. For geometries greater than 65 nanometers, parts that worked well were not necessarily "clean." At 32-nm and lower technology nodes, things that did not matter n…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. PAST, CURRENT, AND FUTURE TECHNOLOGIES/APPLICATIONS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export