SUMMARY


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SUMMARY
SUMMARYAMC continues to grow in importance as a barrier to semiconductor manufacturers with the increased use of 300 mm wafers and copper interconnects. And as they continue toward the use of air gaps, low-k, high-k, porous low-k films, new materials and etchants, atomic layer deposition (ALD), 450 mm wafers and the 10 nm technology node AMC represents a wide range of chemical types that can result in a large number of potential processing problems. Many fabs are more actively addressing old and new types of AMC; however, the effects of specific contaminants on individual processing steps are still not very well understood. Direct correlations between process yield and individual contaminant concentrations, although one of the current "Holy Grails" of contamination control, are either rare or not publish…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. SUMMARY, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export