FAULT DETECTION AND CLASSIFICATION


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FAULT DETECTION AND CLASSIFICATION
FAULT DETECTION AND CLASSIFICATIONAs noted above, R2R control typically relies on measurement of wafer features. The tools used in semiconductor manufacturing are capable of supplying a large number of signals relating to the processing itself and these signals can be leveraged to improve control. One established way to do this is known as fault detection and classification (FDC), where we create a model of each process step consisting of known critical parameters. Depending on the nature of the tool and the process the parameters can vary considerably: one can think of the length of time it takes to execute a part of a process recipe, the input power, the temperature, gas flow, valve position of a pressure regulating valve, etc. By studying the signals of an existing process the …
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. FAULT DETECTION AND CLASSIFICATION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export