COMPARISON WITH OTHER APPROACHES


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COMPARISON WITH OTHER APPROACHES
COMPARISON WITH OTHER APPROACHESThe developed fabrication process enables water-based and room-temperature manufacturing of 3D interconnects without the need for high-vacuum or chemical-based processing. Therefore, this method not only significantly reduces the cost and complexity associated with conventional manufacturing, but it also provides various advantages over the conventional interconnect fabrication techniques (Table 27.1). For example, although electroplating has the advantages of being simple and cost effective in general, not every metal can be electroplated on any conductive surface [25,
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. COMPARISON WITH OTHER APPROACHES, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export