CAPABILITIES OF THE FABRICATION PROCESS


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CAPABILITIES OF THE FABRICATION PROCESS
CAPABILITIES OF THE FABRICATION PROCESSUsing the presented directed assembly approach, any other metallic NPs can be fabricated on any conductive surface. Figure 27.5 shows successful fabrication of interconnects from aluminum, copper, tungsten NPs. Although the melting temperature of tungsten is much higher than the copper and aluminum, it was possible to fuse 10-nm tungsten particles into homogenous interconnect structures by passing an additional amount of current following the assembly process [22].
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. CAPABILITIES OF THE FABRICATION PROCESS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export