MATERIAL CHARACTERIZATION


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MATERIAL CHARACTERIZATION
MATERIAL CHARACTERIZATIONWe placed the fabricated nanopillars on a copper TEM grid using a low-energy lamella lift-out process prior to TEM characterization. The bright-field images indicate that the gold NPs were completely fused during the assembly process, transforming them into homogenous interconnects lacking air voids or gaps. The small-area electron diffraction (SAED) pattern obtained from the entire interconnect presented in the inset to Fig. 27.3 reveals the polycrystalline nature of the interconnects. Only two grains, each having its lattice orientation in one direction, existed over the 30 × 30-nm area of the nanopillar. Recalling that the nominal diameter of an individual NP was 5 nm, we infer that large…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. MATERIAL CHARACTERIZATION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export