3D INTERCONNECT FABRICATION PROCESS


Please sign in to view the rest of this entry.

3D INTERCONNECT FABRICATION PROCESS
3D INTERCONNECT FABRICATION PROCESSThe fabrication process involves directing the assembly of colloidal NPs, using dielectrophoresis (DEP) [11], onto a substrate. The substrate consists of a conductive film (on a rigid or flexible substrate) coated by any patterned insulator [e.g., poly(methyl methacrylate), PMMA or SiO2] that features nanoscale or larger patterns such as vias, trenches, or other geometries as shown in Fig. 27.1a. An ac electric field is applied between the substrate and a counter electrode positioned millimeters away from the substrate in the NP suspension. …
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. 3D INTERCONNECT FABRICATION PROCESS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export