INTRODUCTION


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INTRODUCTION
INTRODUCTIONFlexible electronics are lightweight, rugged, bendable, rollable, portable, and potentially foldable. Much work has been done to address the issues such as patterning and materials combinations to provide optimum performance of thin-film transistors (TFT) and p-i-n photodiodes for flat panel display and image sensor backplanes. However, fabrication of multilayered interconnects in these devices is still challenging. Conventional interconnect fabrication techniques such as electrodeposition and vacuum deposition require high temperature and pressure processing with excessive use of chemical additives, which makes them incompatible with plastics used in flexible electronics. There is a need for a room-temperature and pressure-manufacturing method to create multilayered interconnects for flexi…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. INTRODUCTION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export