HOW ARE FLEXIBLE HYBRID ELECTRONICS MADE?


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HOW ARE FLEXIBLE HYBRID ELECTRONICS MADE?
HOW ARE FLEXIBLE HYBRID ELECTRONICS MADE?As described earlier in this chapter, flexible hybrid electronics are a combination of printed electronics and silicon-based ICs. While the FHE approach has many appealing properties, it also presents significant challenges and limitations. The absence of well-matched adhesive and conductive ink combinations makes attaching rigid packages to flexible substrates very difficult. In addition, maintaining that attachment while flex and band stresses are applied elevates the mechanical integrity challenge to levels not usually encountered in electronics. Finally, package design, especially for complicated ICs is seldom compatible with an overall flexible assembly. These challenges have to date limited the success of hybrid systems and lead …
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. HOW ARE FLEXIBLE HYBRID ELECTRONICS MADE?, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export