FURTHER READING


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FURTHER READING
FURTHER READING A. H. Fischer, A. von Glasow, S. Penka, and F. Ungar, "Process Optimization–The Key to Obtain Highly Reliable Cu Interconnects," Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International, pp. 253–255, 2003. C.-K. Hu, B. Luther, F. B. Kaufman, J. Hummel, C. Uzoh, and D. J. Pearson, "Copper Interconnection Integration and Reliability," Thin Solid Films, 262 (1): 84–92, 1995. I. A. Blech, Physics of Failure in Electronics, Electromigration in Thin Aluminum Films on Titanium Nitride," Journal of Applied Physics, 47 (4): 1203–1…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. FURTHER READING, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export