STRESS MIGRATION


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STRESS MIGRATION
STRESS MIGRATIONStress migration is a physical phenomenon that results from the tendency of voids to merge as means to minimize the surface tension and surface-to-volume ratio in order to achieve a state of lower free energy. The phenomenon seen in copper metallization is not fundamentally different from the merger of bubbles in soap or beer,22 or even on the cosmic scale.23 In copper metallization the manifestation of stress migration is typically with voids that congregate near or under a via. These voids are often referred to as "stress-induced voiding" (SIV) or "via stress migration" (VSM) failur…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. STRESS MIGRATION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export