REFERENCES


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REFERENCES
REFERENCES Jeffrey Rodengen, "50 years of Innovation: Kulicke and Soffa," Write Stuff Syndicate, 2012. I. Qin, B. Milton, G. Schulze, C. Huynh, B. Chylak, and N. Wong, "Wire Bonding Looping Solutions for Advanced High Pin Count Devices," 66th Electronic Components and Technology Conference, pp. 614–621, IEEE, 2016. I. Qin, "Advances in Wire Bonding to Lower the Cost of Interconnect," Chip Scale Reviews, Nov./Dec. issue, pp. 26–29, 2015. Wei (Ivy) Qin, I. M. Cohen, and P. S. Ayyaswamy, "Fixed Wand Electronic Flame Off for Ball Formation in the Wire Bonding Process,"
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. REFERENCES, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export