CONCLUSIONS AND FUTURE DEVELOPMENTS


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CONCLUSIONS AND FUTURE DEVELOPMENTS
CONCLUSIONS AND FUTURE DEVELOPMENTSWire bonding is a mature technology that makes more than 10 trillion bonds each year. New technologies continue to extend the life of wire bonding by further reducing the cost and providing more capability. For cost reduction, alternative wires such as Pd-coated Cu wire, Cu alloy wire, Ag alloy wire, and lower-cost substrate technology, such as PPF (Pre-plated finish) QFN, should be considered. Advanced equipment and process technologies can help retain the material cost savings by ensuring robust and fast bonding processes. For today's advanced node devices with complex looping requirements, the 3D looping tool can help shorten the design cycle, reduce costly redesign, and improve wire bond yield, which in turn, enables wire bonding more complic…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. CONCLUSIONS AND FUTURE DEVELOPMENTS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export