WIRE BONDING PROCESS


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WIRE BONDING PROCESS
WIRE BONDING PROCESSThere are several important aspect of wire bonding process. They will be discussed next.
Free Air Ball Process Free air balls used in ball bonding are formed by the electronic flame off (EFO) discharge. The EFO system consists of an EFO box that supplies the high voltage needed for the arc over, the EFO cable, EFO wand, which serves as the first electrode, and bonding wire which serves as the second electrode. Negative voltage is applied to the EFO wand at the beginning of the EFO fire. Since the wire is grounded, the EFO wand is the negative electrode in this case. The air gap between EFO wand and the grounded wire is ionized by the high voltage. Heat generated by the …
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. WIRE BONDING PROCESS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export