WIRE BONDING EQUIPMENT


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WIRE BONDING EQUIPMENT
WIRE BONDING EQUIPMENT
Wire Bonder Subsystems To be able to accomplish wire bonding process at high speed, very fine scale and with highest reliability, the design of the wire bonders have gone through many years of innovation. An automatic ball bonder is a precision machine with many advanced hardware, software, servo control algorithms, vision algorithm, and advanced process controls. A picture of a K&S fully automatic bonder is shown in Fig. 19.7. Some of the key subsystems are labeled. The main subsystems and their functionality are explained below.
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. WIRE BONDING EQUIPMENT, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export