INTRODUCTION


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INTRODUCTION
INTRODUCTION
History and Current Capability One of the most important steps in semiconductor packaging is to connect the IC to the substrate. This step is called interconnect. There are several interconnect technology including wire bonding, flip chip, and TAB bonding. Among the different interconnect technologies, wire bonding is the most popular interconnect method due to its low cost, flexibility, and large installed base. Wire bonding uses conductive wires such as Au and Cu to connect the die to the substrate. The first wire bond ever made can be traced back to the first transistor born in Bell Labs in 1947. In the early years, there are only a few wires in e…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. INTRODUCTION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export