REFERENCES


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REFERENCES
REFERENCES H. Oppermann, Vorlesung: Aufbau- und Verbindungstechnik für Mikrosysteme, TU Cottbus, 2003. Lit W. Jillek and G. Keller, Handbuch der Leiterplattentechnik, Eugen Leuze Verlag, Germany, 2003. J. Lau and K. Liu, "Lead-free Soldering," Advanced Packaging Magazine, p. 28, Feb. 2004. Advanced IC Packaging Markets and Trends, 7th ed., Electronic Trend Publication, 2003. E. G. Combs, "Leadless Plastic Packages, Such as the DFN and …
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. REFERENCES, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export