OPTOELECTRONICS AND MEMS PACKAGING


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OPTOELECTRONICS AND MEMS PACKAGING
OPTOELECTRONICS AND MEMS PACKAGINGOptoelectronics and MEMS impose new challenges on the packaging, test, and assembly of micro devices. Typical MEMS devices include inkjet printer heads, magnetic read/write heads, micro mirror arrays, pressure, and acceleration sensors and gyroscopes. Optoelectronic systems range from discrete components such as LEDs and semiconductor laser diodes to complex modules combining active and passive optical and electronic components on one board (Fig. 18.41). Optical and mechanical functions have to be maintained by package and assembly. Chemical or biological sensors need packages that allow chemical and biological reactions of the device with the environment. All this has a bi…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. OPTOELECTRONICS AND MEMS PACKAGING, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export