WAFER BUMPING AND REDISTRIBUTION TECHNOLOGY


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WAFER BUMPING AND REDISTRIBUTION TECHNOLOGY
WAFER BUMPING AND REDISTRIBUTION TECHNOLOGY
Process Technology
Wafer Bumping Overview A bump is defined as a usually conducting three-dimensional interconnect element between die and substrate. In most cases the bump is formed on the wafer prior to wafer dicing and die attach. This process is called wafer bumping. Interconnect methods are soldering, thermo-compression bonding, and adhesive bonding (Fig. 18.2). Depending on the application, many different bump metallurgies are used ranging from pure Au, Cu, Sn, or In to alloys such as PbSn, A…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. WAFER BUMPING AND REDISTRIBUTION TECHNOLOGY, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export