PACKAGING EVOLUTION


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PACKAGING EVOLUTION
PACKAGING EVOLUTIONThe evolution of single-chip packages has started from metal encapsulations and developed over the dual inline package (DIP) for through-hole assembly and SMT packages such as the plastic quad flat package (PQFP) and the BGA to the chip-size package (CSP) (see Fig. 18.6). DIP and PQFP represent packages with peripheral I/Os while BGAs and CSPs are area array packages, where a CSP is defined as a package that is only marginally larger than the chip itself. The highest level of electrical performance is achieved by direct chip attach (DCA), where a bare die is attached onto the PCB. This method has been used long before the introduction of CSPs, but the absence of any package for the die has limited the im…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. PACKAGING EVOLUTION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export