INTRODUCTION


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INTRODUCTION
INTRODUCTIONElectronic packaging and assembly are needed to link the small dimensions of the IC to an interconnecting substrate—usually the printed circuit board (PCB). The PCB combines a multitude of ICs and passive components to build a microelectronic system. New device technologies and applications with their ever increasing performance and functionality are driving the requirements and innovation for assembly and packaging. The technology boundaries between semiconductor technology, packaging, and system design are becoming blurred. As a result chip, package, and system designers will have to work closer together than ever before in order to drive the performance for future microelectronic systems. Flip chip in package (FCIP), flip chip on board (FCOB), wafer level packaging (WLP), and system in pac…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. INTRODUCTION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export