3D INTEGRATION WITH THROUGH SILICON VIA


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3D INTEGRATION WITH THROUGH SILICON VIA
3D INTEGRATION WITH THROUGH SILICON VIA
Advantage of 3D Integration As mentioned in the introduction, economical, and technical limitations in current scaling trends have provided an opportunity for 3D integration with TSV to potentially become an alternative to conventional scaling technology for enhancing the performance and density of devices. Compared to 2D integration such as system-on-chip (SoC) technology, 3D integration has several features as shown in Fig. 17.13.18 First, 3D integra…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. 3D INTEGRATION WITH THROUGH SILICON VIA, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export