DBG AND SDBG


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DBG AND SDBG
DBG AND SDBG
Dicing before Grinding DBG reverses the conventional process order in which wafers are diced after grinding. In the DBG process, the device surface of the wafer is first grooved in a process known as half cut dicing. As the wafer is thinned from the backside, singulation occurs naturally once the thinning process reaches the bottom of the grooves, as shown in Fig. 17.12.
Conventional and DBG and SDBG process flow. (<emphasis role="italic">Courtesy of DISCO Corporation</emphasis>.)
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. DBG AND SDBG, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export