DBG AND SDBGDBG AND SDBGDicing before GrindingDBG reverses the conventional process order in which wafers are diced after grinding. In the DBG process, the device surface of the wafer is first grooved in a process known as half cut dicing. As the wafer is thinned from the backside, singulation occurs naturally once the thinning process reaches the bottom of the grooves, as shown in Fig. 17.12.
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. DBG AND SDBG, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering