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LASER TECHNOLOGYLaser processing was introduced relatively recently for use in the semiconductor singulation process. Laser processing employs a laser beam instead of a dicing blade to achieve separation. It has been developed as an alternative way to solve the issues in blade dicing such as chipping and delamination. Currently, there are two types of laser dicing methods available in semiconductor manufacturing, one is laser ablation and another is SD. Details for both methods will be discussed in the following sections.
Laser Ablation In the laser ablation process, a short-pulse laser is focused on the wafer surface, as shown in
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. LASER TECHNOLOGY, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export