SINGULATION TECHNOLOGY OVERVIEW AND BLADE DICING


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SINGULATION TECHNOLOGY OVERVIEW AND BLADE DICING
SINGULATION TECHNOLOGY OVERVIEW AND BLADE DICINGSingulation is a process where semiconductor wafers are separated into individual die. The singulation process using diamond blades is also known as dicing. In Secs. 17.5 to 17.7, general dicing methods such as blade dicing, laser grooving, and stealth dicing (SD) will be discussed.The concept of "dicing" here refers to the general blade dicing process for a mono-crystal silicon wafer after thinning via the backgrinding process. After thinni…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. SINGULATION TECHNOLOGY OVERVIEW AND BLADE DICING, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export