THINNING TECHNOLOGY, STRESS RELIEF, AND OTHER REQUIREMENTS


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THINNING TECHNOLOGY, STRESS RELIEF, AND OTHER REQUIREMENTS
THINNING TECHNOLOGY, STRESS RELIEF, AND OTHER REQUIREMENTS
Issues of Wafer Thinning Since innovation in packaging technology has required thinner and smaller, wafer thinning less than 100 μm thickness is key technology to realize the demand (refer to Sec. 17.1). In general, as a wafer becomes thinner, the risk of wafer breakage increases. The main causes of wafer breakage are as follows:
Decrease of Mechanical Strength The thinner the wafer becomes, the lower the …
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. THINNING TECHNOLOGY, STRESS RELIEF, AND OTHER REQUIREMENTS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export