THINNING PROCESS AND EQUIPMENT


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THINNING PROCESS AND EQUIPMENT
THINNING PROCESS AND EQUIPMENTA typical grinder polisher is composed of several sections performing the various functions.
Grinding Section Figure 17.3 illustrates the workflow. Many fully automatic grinder polishers follow this pattern.10 The wafer is unloaded from the wafer cassette and transferred to the processing section. There are four wafer chuck tables, which are placed on a turn table onto which the rotating spindle descends. The Z1 spindle is for rough grinding, the Z2 spindle is for fine grindin…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. THINNING PROCESS AND EQUIPMENT, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export