THINNING TECHNOLOGY OVERVIEW: GRINDING


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THINNING TECHNOLOGY OVERVIEW: GRINDING
THINNING TECHNOLOGY OVERVIEW: GRINDINGGrinding, also known as BG, refers to backgrinding. After the wafer fabrication process, a surface protection tape, called BG tape, is attached to the device layer of the wafer prior to grinding. The wafer is turned over and the back of the device wafer is ground to thin the wafer enough for it to be assembled into a package.5The overall package thickness is determined by global standards; the overall thickness has to be sufficient to accommodate the lead frame, die, molded plastic, and paste or die attach film
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. THINNING TECHNOLOGY OVERVIEW: GRINDING, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export