INTRODUCTION


Please sign in to view the rest of this entry.

INTRODUCTION
INTRODUCTIONThis chapter covers the fundamental concepts and practical applications of thinning and singulation processes for silicon wafers, which are formed transistors and interconnects in the front-end-of-line (FEOL). Since the wafer thinning and singulation processes take place before assembly and packaging, it is important to provide accurate process control as well as quality for enabling the subsequent packaging processes, such as die bonding, wiring, and molding.The semiconductor industry is now facing a major challenge, due to both economic and technical limitations, in how to realize the next generation of scaling technology. Presently, advanced package technologies such as wafer level packages a…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. INTRODUCTION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export