SUMMARY


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SUMMARY
SUMMARYWith the continued growth of semiconductor device applications and commercial market penetration, CMP as an enabling technology to manufacture semiconductor chips has become one of the most critical process steps. With varieties of materials as thin films used in a semiconductor wafer manufacturing, the need to develop different types of consumables such as slurry, pad, conditioning disk, post-CMP clean, filter, etc., will continue to grow in demand. It is, therefore, absolutely important to understand the fundamental aspects and mechanisms of various interactions occurring during CMP processes.
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. SUMMARY, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export