POST-CMP CLEANING


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POST-CMP CLEANING
POST-CMP CLEANINGPost-CMP cleaning is an integral part of the CMP process module to clean up the debris and other chemical residues left on wafers during CMP. There are two types of cleaning technology in use: megasonic bath and double-sided scrubber with Polyvinyl alcohol (PVA) brushes. Both have advantages and disadvantages and may be employed individually or in combination as needed to achieve effective cleaning of the wafers. The megasonic approach is sometimes useful in removing particles from narrow recesses of a polished wafer if the surface features are not completely coplanar. Brush scrubbers, on the other hand, are particularly useful at dislodging particles that may be physically attracted to the copper surface. It is relatively common to use the combination of both megasonic cleaning an…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. POST-CMP CLEANING, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export