MECHANISM OF CMP PROCESS


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MECHANISM OF CMP PROCESS
MECHANISM OF CMP PROCESSAlthough CMP is now extensively used for fabricating integrated circuits, the polishing process itself was used in optical lens manufacturing for several centuries. Sir Isaac Newton in 1695 observed that scratch size decreased as abrasive size was decreased. By using very fine grain abrasives, he noted, it was possible to continually fret and wear away the glass and produce a polished surface on which the scratches become too small to be visible. Along the line of this hypothesis, Lord Rayleigh found in 1901 that the polishing process produced highly reflective, structure-less facets in a discontinuous fashion [11]. Further polishing did not improve the quality of the facets but extended their b…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. MECHANISM OF CMP PROCESS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export