THE CMP APPLICATION PROCESS


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THE CMP APPLICATION PROCESS
THE CMP APPLICATION PROCESSIn a CMP process, the wafer being planarized is pressed (facing down) onto a polymeric polishing pad and is abraded in the presence of a slurry, which contains active chemicals and abrasive particles. Thus, CMP can be described as a process which uses the combination of mechanical energy from the pad and abrasives and chemical energy from the slurry chemicals to polish and remove material from the wafer surface. The process flow has been described by the schematic diagram in further detail by Zantye et al. [7].For CMP, therefore, one needs to use some consumables such as polishing pad, wafer, polishing slurry, pad conditioning disk, and post-CMP cleaning soluti…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. THE CMP APPLICATION PROCESS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export