POLISHING VERSUS PLANARIZATION


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POLISHING VERSUS PLANARIZATION
POLISHING VERSUS PLANARIZATIONAlthough in various circumstances, chemical mechanical (p)olishing is still used instead of (p)lanarization, there is a significant difference between polishing a bare wafer surface of one film and planarizing a patterned wafer surface with several topographic features incorporating films of various materials. Polishing a surface means removing the top surface material at an uniform rate irrespective of the topographic features while making the surface smooth. Planarization means removing the surface of the substrate (possibly exposing different types of materials) at different rates depending on the features while achieving global planarity (flat) across the substrate surface. The process depends on both chemical and mechanical actions on the surface of th…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. POLISHING VERSUS PLANARIZATION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export